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Jumper Chip Product List and Ranking from 4 Manufacturers, Suppliers and Companies | IPROS GMS

Jumper Chip Product List

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Thermal Jumper Chip "BTJ Series"

Thermal Jumper Chip "BTJ Series"

By jumping important patterns, the design freedom will also increase!

The "BTJ Series" is a thermal jumper chip that allows for board mounting while maintaining insulation without conductive paths, enabling thermal transfer and heat dissipation. It can be installed in locations where heat dissipation for power semiconductors such as MOSFETs and IGBTs, as well as ceramic resistors, is difficult, and if space is allocated in advance for pattern design, it can also be mounted later. With the increase in power consumption and the densification of mounted components, as well as the miniaturization of chip resistors, it solves the problem of excessive temperature rise due to board heat dissipation. 【Features】 ■ High thermal conductivity ■ High insulation resistance ■ Low capacitance ■ Increased design flexibility for patterns *For more details, please download the PDF (English version) or feel free to contact us.

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  • Other electronic parts
  • Jumper Chip

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TT Electronics TJC Series

TT Electronics TJC Series

TJC Series Thermal Jumper Chip

TJC provides designers with thermal management solutions under high power density, eliminating the need for EMI countermeasure design.

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BOURNS Thermal Jumper Chip Insulation + Heat Transfer and Dissipation

BOURNS Thermal Jumper Chip Insulation + Heat Transfer and Dissipation

Recommended for heat dissipation of power semiconductors such as MOSFETs and IGBTs, as well as ceramic resistors; can be installed in locations where heat sinks are difficult to set up.

BOURNS has announced the new BTJ Thermal Jumper Chip series for heat dissipation in various electronic device applications. The BTJ series is a unique surface-mounted component that provides high thermal conductivity while also possessing insulating properties. This series is suitable for thermal conduction and heat dissipation in various mobile devices and electronic equipment. Furthermore, by utilizing its insulating properties, it can fill the space between the heating element and the thermal detection element, enabling high-precision thermal detection. These features help reduce the temperature rise of key components and contribute to improved system-level reliability.

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Thermal jumper chip for solar power inverter

Thermal jumper chip for solar power inverter

Solving the inverter's heat dissipation problem! Achieving both insulation and thermal conductivity.

In the solar power inverter industry, there is a demand for high efficiency and long lifespan of systems. In particular, the power semiconductors inside the inverter tend to generate heat, making proper heat dissipation measures essential. Inadequate heat dissipation can lead to component degradation or failure, potentially compromising the reliability of the system. BOURNS' thermal jumper chip achieves high thermal conductivity and insulation, addressing the heat dissipation issues of inverters. It reduces the temperature rise of key components and contributes to improved system-level reliability. 【Usage Scenarios】 - Power semiconductors such as MOSFETs and IGBTs inside the inverter - Ceramic resistors - Areas where the installation of heat sinks is difficult 【Benefits of Implementation】 - Suppression of component temperature rise - Improved system reliability - Contribution to longer lifespan

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Thermal jumper chip for GPU heat dissipation for gaming consoles

Thermal jumper chip for GPU heat dissipation for gaming consoles

Solving GPU heat issues! A thermal jumper chip that balances insulation and thermal conductivity.

In the gaming console industry, addressing the heat generated by high-performance GPUs is a critical issue that affects product performance and reliability. Especially during high-load gameplay, the rise in GPU temperature can lead to performance degradation or failure. Our thermal jumper chip, which combines high thermal conductivity and insulation, solves the heat problems of GPUs even in areas where installing heat sinks is difficult. 【Application Scenarios】 - GPU - Power semiconductors such as MOSFETs and IGBTs - Ceramic resistors 【Benefits of Implementation】 - Reduces temperature rise of key components - Improves system-level reliability

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Jumper Chip "RPC Series"

Jumper Chip "RPC Series"

Introducing jumper chips compatible with automatic implementation machines using taping methods!

The "RPC Series" is a jumper (0Ω) chip compatible with flow and reflow soldering, as well as automatic placement machines using taping methods. It features a robust three-layer electrode structure that prevents solder wicking. Additionally, it does not use mercury, cadmium, hexavalent chromium, polybrominated biphenyls, or polybrominated diphenyl ethers. 【Features】 ■ Jumper (0Ω) chip ■ Robust three-layer electrode structure that prevents solder wicking ■ Compatible with flow and reflow soldering ■ Compatible with automatic placement machines using taping methods ■ AEC-Q200 compliant (data acquisition) Note: Some may not be compliant. *For more details, please refer to the PDF document or feel free to contact us.

  • Resistors
  • Jumper Chip

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Sulfur-resistant jumper chip "RXC series"

Sulfur-resistant jumper chip "RXC series"

Achieving excellent sulfurization resistance! Introduction of jumper (0Ω) chips.

The "RXC Series" is a jumper (0Ω) chip that achieves excellent sulfuration resistance characteristics by adopting special internal electrodes. It complies with AEC-Q200 (data acquisition). Additionally, it has never used mercury, cadmium, hexavalent chromium, polybrominated biphenyls, or polybrominated diphenyl ethers. 【Features】 ■ Jumper (0Ω) chip ■ Adoption of special internal electrodes ■ Excellent sulfuration resistance characteristics ■ Complies with AEC-Q200 (data acquisition) Note: There may be some cases where it does not comply. *For more details, please refer to the PDF document or feel free to contact us.

  • Resistors
  • Jumper Chip

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Sulfur-resistant multi-terminal jumper chip 'RXB03 T4'

Sulfur-resistant multi-terminal jumper chip 'RXB03 T4'

By adopting a special internal electrode, excellent sulfuration resistance characteristics are achieved! Sulfuration-resistant multi-terminal jumper chip.

The "RXB03 T4" is a multi-terminal jumper chip that is handled by Taiyosha Electric Co., Ltd., which manufactures and sells fixed resistors. By adopting a special internal electrode, it achieves excellent sulfurization resistance. It is compatible with sulfurization resistance for various lineup products. (Please refer to the catalog.) 【Features】 ■ Jumper (0Ω) chip ■ Achieves excellent sulfurization resistance through the adoption of a special internal electrode ■ Compatible with sulfurization resistance for various lineup products *For more details, please refer to the PDF materials or feel free to contact us.

  • Other machine elements
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BTJ Thermal Jumper Chip for Data Centers

BTJ Thermal Jumper Chip for Data Centers

Solve server heat issues! Achieving both insulation and thermal conductivity.

The servers in data centers require efficient heat dissipation to maintain high processing power. Excessive temperature rise can lead to system instability and failures, resulting in increased operational costs. The BTJ thermal jumper chip achieves both high thermal conductivity and insulation, suppressing temperature rise in key components within the server. This contributes to improved system reliability and long-term stable operation. 【Usage Scenarios】 - Heat dissipation for server CPUs, GPUs, power supply units, etc. - Installation in areas where heat sinks are difficult to place - Thermal management in high-density mounted circuit boards 【Benefits of Implementation】 - Suppresses temperature rise in components, enhancing system reliability - Reduces server downtime and lowers operational costs - Contributes to space-saving and promotes high-density server configurations

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Thermal jumper chip for industrial robots

Thermal jumper chip for industrial robots

Solve the motor's heat problem! Achieve both heat dissipation and insulation.

Industrial robot motors require high operational precision and durability. Overheating of the motor can lead to performance degradation and failures, potentially compromising the reliability of the robot system. Effective heat dissipation measures are essential, especially for high-power motors and those placed in confined spaces. BOURNS' thermal jumper chip achieves high thermal conductivity and insulation, addressing the thermal issues of motors. 【Usage Scenarios】 - Motors for industrial robots - High-power motors - Areas where heat sink installation is difficult 【Benefits of Implementation】 - Suppression of motor temperature rise - Improved system reliability - Reduced risk of failure

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Thermal jumper chip for wearable devices

Thermal jumper chip for wearable devices

Contributing to the miniaturization and reliability improvement of wearable devices.

In the field of wearable devices, miniaturization and high functionality are progressing, and as a result, thermal management has become an important issue. Heat inside the device can lead to performance degradation and failures, potentially shortening the product's lifespan. The BTJ thermal jumper chip achieves both high thermal conductivity and insulation, enabling efficient heat dissipation within limited space. This contributes to the miniaturization and reliability improvement of wearable devices. 【Usage Scenarios】 - Wearable devices that require miniaturization - Devices with high-density mounting - Electronic components that require thermal management 【Effects of Implementation】 - Suppression of device temperature rise - Improvement of product reliability - Increased design flexibility

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Multi-connection jumper chip 'RPB03 T4'

Multi-connection jumper chip 'RPB03 T4'

Compatible with automatic implementation machines using taping methods! It boasts excellent dimensional accuracy and reduces errors during implementation.

The "RPB03 T4" is a multi-terminal jumper chip compatible with both flow and reflow soldering. It features a robust three-layer electrode structure that prevents solder wicking, and is compatible with automatic placement machines using taping methods. It has excellent dimensional accuracy, reducing errors during assembly. 【Features】 ■ Jumper (0Ω) chip ■ Robust three-layer electrode structure that prevents solder wicking ■ Compatible with flow and reflow soldering ■ Compatible with automatic placement machines using taping methods ■ Excellent dimensional accuracy, reducing errors during assembly *For more details, please refer to the PDF document or feel free to contact us.

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  • Jumper Chip

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